Browse Prior Art Database

Photosensitive Polyimide Coatings

IP.com Disclosure Number: IPCOM000079538D
Original Publication Date: 1973-Jul-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Saunders, TF: AUTHOR [+3]

Abstract

Photosensitive polyimide coating formulations of N-substituted bismaleimides, with and without substituents in the 3- and 4- positions, can be linearly photopolymerized to a soluble ladder polymer configuration and photocross linked to give insolubilized products. This reaction is the basis for the following photosensitive coating and dielectric system: (Image Omitted)

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Photosensitive Polyimide Coatings

Photosensitive polyimide coating formulations of N-substituted bismaleimides, with and without substituents in the 3- and 4- positions, can be linearly photopolymerized to a soluble ladder polymer configuration and photocross linked to give insolubilized products. This reaction is the basis for the following photosensitive coating and dielectric system:

(Image Omitted)

The following items can be incorporated into the photosensitive poly-bis-maleimide coating formulation for enhancing both the rate and extent of photocross linking and/or ladder polymer formation:
a) one or more of the following high-functionality maleimides:

wherein the 3 and 4 positions of the maleimide rings may or may

not be substituted with -CH(3) or other appropriate

substituent:

2, 4, 6 - tris-maleimide-s-triazine

4, 4', 4'' - tris-maleimide triphenylmethane chloride

3, 4, 3', 4' - tetrakis-maleimide benzidine

or the poly-maleimide prepared from highly branched

polyethylenimine (25-30% 1 degrees amine functionality) and

maleic anhydride.
b) one of the following known photosensitizers:

acetophenone

2-hydroxy acetophenone

and other acetophenone derivatives which are characterized by

high triplet state energies (AH > 70 keal/mole). Also other

high-energy sensitizers.

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