Browse Prior Art Database

Ceramic Surface Preparation

IP.com Disclosure Number: IPCOM000079549D
Original Publication Date: 1973-Jul-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Narken, B: AUTHOR

Abstract

Cracks and crevices illustratively depicted at 10 and 12 formed on a fired ceramic substrate 14 limit the ultimate line resolution of metallurgical patterns, which are to be deposited on the upper surface of the fired ceramic substrate 14. The existence of the crevices causes shorting between adjacent lines and further allows the entrapment of chemical contaminants, which are destructive when the ceramic substrate is employed in the fabrication of multilayer ceramic interconnection packages.

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Ceramic Surface Preparation

Cracks and crevices illustratively depicted at 10 and 12 formed on a fired ceramic substrate 14 limit the ultimate line resolution of metallurgical patterns, which are to be deposited on the upper surface of the fired ceramic substrate 14. The existence of the crevices causes shorting between adjacent lines and further allows the entrapment of chemical contaminants, which are destructive when the ceramic substrate is employed in the fabrication of multilayer ceramic interconnection packages.

This approach allows direct metal deposition on the ceramic surface. As shown in Fig. 2, this is accomplished by depositing a glass layer 16 over the ceramic body, which results in filling of the cracks and crevices 10 and 12. Thereafter, as shown in Fig. 3, the ceramic body is subjected to a high-powered machining step which removes the glass layer 16 and exposes the ceramic upper surface 18, while leaving the cracks and crevices 10 and 12 filled with the glass filament material depicted at 20 and 22. This results in a high-grade ceramic surface, upon which direct metallized lines can be deposited.

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