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Browse Prior Art Database

Stacked Wafer Package

IP.com Disclosure Number: IPCOM000079551D
Original Publication Date: 1973-Jul-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Miller, LF: AUTHOR

Abstract

This package arrangement has particular advantages for stacking a plurality of wafers, generally depicted at 10, with a base supporting member 12. The arrangement constitutes a minimum number of parts and tolerances can be readily adjusted. The wafers can easily be replaced without disrupting the stacked arrangement connected to the base 12 and, cooling is implementable with any desired medium.

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Stacked Wafer Package

This package arrangement has particular advantages for stacking a plurality of wafers, generally depicted at 10, with a base supporting member 12. The arrangement constitutes a minimum number of parts and tolerances can be readily adjusted. The wafers can easily be replaced without disrupting the stacked arrangement connected to the base 12 and, cooling is implementable with any desired medium.

The wafers are stacked by supporting means at each end, one of which ends is not shown, by a plurality of insulative spacers 13, 14, 16, 18 and 20, which are held in a compressive arrangement by a force exerted by spring 22 on the upper capping member, shown partially broken away at 24. Significantly, electrical contacts can be readily made by lead frames to each of the individual wafers, by the plurality of wires 28, 30, 32 and 34.

A suitable wire holder comb, schematically represented at 36, is employed to unite the plurality of wires and which then can be readily modified for communication with external circuits or outer units. It can be seen that this arrangement allows individual wires to be severed in order to remove or repair a particular wafer 10.

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