Browse Prior Art Database

Coating Process

IP.com Disclosure Number: IPCOM000079602D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Perrault, AJ: AUTHOR [+4]

Abstract

Thin layers of adhesion promoting material for photoresists are coated with substrates, using a vapor-disposition technique.

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Coating Process

Thin layers of adhesion promoting material for photoresists are coated with substrates, using a vapor-disposition technique.

Adhesion promoting materials, such as the hexa-alkyldisilazane adhesives described in U. S. Patent 3,549,368, have been used as undercoats for improving the adhesion of resists to surfaces, such as SiO(2), quartz, silicon nitride and phosphosilicate glass. The presence of moisture in the adhesion promoting material can adversely effect the performance of the system. Vapor deposition at ambient or elevated temperatures provides a solution to the moisture problem.

The figures show apparatus for carrying out a vapor deposition at elevated temperatures. Wafers 1 in holder 2 are placed in closed chamber 3 containing liquid adhesive 4 in the bottom. Adhesive 4 is heated to form vapors which impinge on wafers 1 and form a molecular coating. The vapors in the closed system are condensed by condensor 5 and liquid adhesive droplets 6 are returned to the bottom of chamber 3. The principal of fractional distillation operates to produce moisture-free adhesive vapors which contact wafers 1.

Alternately a vacuum chamber 8 holds wafers 1 in holder 2. A supply 9 of adhesive 4 is provided with line 10 and valve 11 leading to chamber 8. Chamber 8 is evacuated and valve 11 is then opened causing adhesive 4 to vaporize under the reduced pressure. The vapor enters chamber 8 and coats wafers 1. A nitrogen purge line 12 with valve 13 is provided fo...