Browse Prior Art Database

Forming Conductive Lines and Studs for Circuit Device

IP.com Disclosure Number: IPCOM000079682D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Best, B: AUTHOR

Abstract

Fig. 1 shows a copper sheet 2 that has upper copper-chrome regions 3 and lower chrome regions 4, which are plated according to a pattern of lines and studs that is to be formed in sheet 2. The structure can be manufactured in an automated continuous process, in which sheet 2 is formed from a ribbon of copper. Photoresists are formed on both sides of the ribbon and are exposed and developed, and the chrome patterns are plated on both the upper and the lower surface of the ribbon.

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Forming Conductive Lines and Studs for Circuit Device

Fig. 1 shows a copper sheet 2 that has upper copper-chrome regions 3 and lower chrome regions 4, which are plated according to a pattern of lines and studs that is to be formed in sheet 2. The structure can be manufactured in an automated continuous process, in which sheet 2 is formed from a ribbon of copper. Photoresists are formed on both sides of the ribbon and are exposed and developed, and the chrome patterns are plated on both the upper and the lower surface of the ribbon.

The lower chrome regions 4 provide good adhesion to glass or other inorganic or organic material of a substrate 5 that is shown in Fig. 2. The upper chrome region 3 forms a resist for etching the unwanted copper regions to form the circuit device of Fig. 2.

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