Browse Prior Art Database

Electrical Wafer Connecting Element

IP.com Disclosure Number: IPCOM000079710D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Coombs, VD: AUTHOR [+2]

Abstract

This is a cylindrical element for electrically connecting the paths on a silicon wafer (chip) to the lands on an organic circuit substrate. The cylindrical element 10 is a semirigid decal type member having printed-circuit lines 11 thereon. The element 10 should provide moderately stiff support for the wafer 12, but should be capable of yielding in the X and Y directions due to the thermal mismatches between the wafer 12 and the substrate 13, without destruction or damage of the terminal areas 14 and 15 on the wafer 12 and the substrate 13, respectively.

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Electrical Wafer Connecting Element

This is a cylindrical element for electrically connecting the paths on a silicon wafer (chip) to the lands on an organic circuit substrate. The cylindrical element 10 is a semirigid decal type member having printed-circuit lines 11 thereon. The element 10 should provide moderately stiff support for the wafer 12, but should be capable of yielding in the X and Y directions due to the thermal mismatches between the wafer 12 and the substrate 13, without destruction or damage of the terminal areas 14 and 15 on the wafer 12 and the substrate 13, respectively.

It is essential that the electrical terminations 14 on the wafer 12 be made on the circumference of the wafer 12. The terminals 14 match the printed-circuit lines 11, and will electrically interconnect with the terminal paths 15 along the circumference of the organic substrate 13.

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