Browse Prior Art Database

Surface Priming to Enhance Adhesion to Silicone Elastomer

IP.com Disclosure Number: IPCOM000079713D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Acitelli, MA: AUTHOR [+4]

Abstract

In electronic component manufacture modules are frequently backsealed with silicone rubber, in order to protect internal metallurgy from corrosion and subsequent malfunction.

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Surface Priming to Enhance Adhesion to Silicone Elastomer

In electronic component manufacture modules are frequently backsealed with silicone rubber, in order to protect internal metallurgy from corrosion and subsequent malfunction.

A technique has been developed to render silicone rubber structurally bondable with various adhesive chemical types, i.e., epoxy, acrylic, polyurethane, etc., and is especially adaptable to delicate electronic modules and components which are backsealed with silicones.

Parylene C [poly(monocloro-p-xylylmie)] is deposited onto silicone surfaces by a process of vapor deposition, so as to form a continuous thin film having intimate surface contact with the silicone rubber. This coating of a low-surface free-energy substrate, such as silicone rubber with parylene C, prior to the adhesive bonding to other material provides structural integrity, and permits the application of subsequent coatings of a variety of materials in order to obtain whatever film properties are desired.

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