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Water Soluble Solder Flux

IP.com Disclosure Number: IPCOM000079725D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Herrmann, RC: AUTHOR [+3]

Abstract

In a soldering operation, flux serves to remove oxide surface films from metal and solder, and then to prevent oxidation during joint formation. In addition to performing this function, this family of fluxes can be used as an adhesive prior to soldering, as a mask in a process which uses nonpolar solvents prior to soldering, and unused portions can be easily washed from a workpiece without disturbing the solder bond.

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Water Soluble Solder Flux

In a soldering operation, flux serves to remove oxide surface films from metal and solder, and then to prevent oxidation during joint formation. In addition to performing this function, this family of fluxes can be used as an adhesive prior to soldering, as a mask in a process which uses nonpolar solvents prior to soldering, and unused portions can be easily washed from a workpiece without disturbing the solder bond.

The general formula for these compositions includes polyvinyl alcohol, a solvent system, and a water soluble flux ingredient. Polyvinyl alcohols exhibiting 85-100% mole percent hydrolysis are preferred. The solvent system may be water or water and a substantial amount of compatible solvent, such as ethanol. Water soluble organic compounds including an active hydrogen moiety, or proprietary water soluble fluxes are also included.

These compositions can be rendered water insoluble by the addition of boric acid or borax.

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