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Standardized Multilayer Pin Lead Frame Contactor

IP.com Disclosure Number: IPCOM000079738D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Caccoma, GA: AUTHOR [+3]

Abstract

This is a technique for contacting a dense array of conductive pads on a semiconductor chip.

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Standardized Multilayer Pin Lead Frame Contactor

This is a technique for contacting a dense array of conductive pads on a semiconductor chip.

This contactor consists of a master guide plate, contact pins, and a lead frame/spacer subassembly. The master guide plate has holes in it determining a standard pitch in both X and Y axes and accepts contact pins. The contact pins make contact to each conductive pad on the semiconductor chip. The lead frame/spacer subassembly is an etched part, with pitch in the direction determined by the standard grid. The spacer is a dielectric sheet Which has lead frame locator holes punched or drilled. The pitch of the holes reflects the pitch of the standard grid. Pitch of the holes in the Y direction facilitates fabrication of the part, such that P (x) can be held without constrictions to pin size.

The layered guide plates provide variable length guide holes for the various length contact pins, preventing buckling of the pins.

The layered guide plates can be replaced by a molded assembly with all the holes in it, as illustrated in Fig. 2.

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