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Partially Prewired Integrated Circuit Masterslices

IP.com Disclosure Number: IPCOM000079759D
Original Publication Date: 1973-Aug-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Cass, EE: AUTHOR [+2]

Abstract

In integrated circuit masterslice technology, it has been the practice to completely tailor the masterslice configuration in accordance with circuit needs. It has now been recognized that it may be, in many instances, more effective to arrange the devices and metallization in a given masterslice configuration, so that a portion of the potential integrated circuit may be prewired in accordance with circuit requirements which are common to all possible circuits in a particular masterslice family, and to then implement the differences between the various masterslices by tailoring only the remainder of the masterslice.

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Partially Prewired Integrated Circuit Masterslices

In integrated circuit masterslice technology, it has been the practice to completely tailor the masterslice configuration in accordance with circuit needs. It has now been recognized that it may be, in many instances, more effective to arrange the devices and metallization in a given masterslice configuration, so that a portion of the potential integrated circuit may be prewired in accordance with circuit requirements which are common to all possible circuits in a particular masterslice family, and to then implement the differences between the various masterslices by tailoring only the remainder of the masterslice.

For example, in many masterslice configurations, the current needed to drive circuits which are off the integrated circuit chip (driver currents) can range up to three times the current needed for on-chip connections (internal currents). Therefore, interconnections between driver circuitry and off-chip output pins must be of low resistance. Accordingly, the connections between the driver circuit and the off-chip output points must have extra wide metallization, in order to accommodate such high-current requirements.

Accordingly, it is proposed that at least one wide metallization path be provided from each driver circuit to its particular output point. If the driver circuit is used in the masterslice, its high-current output is already connected to its output point or pad through a metallization line a...