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Electrolessly Plating Alloys

IP.com Disclosure Number: IPCOM000079766D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ballas, DF: AUTHOR [+3]

Abstract

An alloy, specifically a III - V alloy or a mixed III - V alloy, is electrolessly plated by immersing it in a mixture of two solutions, one of which contains the main element, specifically gold, to be plated which element adheres well to the surface of the alloy.

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Electrolessly Plating Alloys

An alloy, specifically a III - V alloy or a mixed III - V alloy, is electrolessly plated by immersing it in a mixture of two solutions, one of which contains the main element, specifically gold, to be plated which element adheres well to the surface of the alloy.

For a P-type contact, 400 mg of zinc chloride (ZnCl(2)) crystals are added to 50 ml gold chloride (HAuCl(2).5H(2)O) solution comprising 1.5 g gold chloride. The surface to be plated is immersed at room temperature for 2 - 3 minutes. If a masking material other than SiO(2) is used, a few drops of HG added to the plating solution will prevent oxidation of the surface.

For an N-type contact, 100 mg stannous chloride (SnCl(2).2H(2)O) crystals are added to the 50 ml gold chloride solution. A precipitate is filtered off or dissolved by a few ml HCl. The surface to be plated is immersed at room temperature for a few minutes.

Annealing of the plated surface at 450 degrees C in a forming gas (N(2) with 5-10% H(2)) assures good contacts.

The quantities of gold and ZnCl(2) resp. SnCl(2) may vary dependent on the composition of the contacts desired.

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