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Thermoplastic Powders as Filling Materials for Special Ceramic Substrates

IP.com Disclosure Number: IPCOM000079815D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Franz, KH: AUTHOR [+3]

Abstract

A method is described to avoid the closing of via holes punched in green ceramic substrates during the subsequent lamination process. In the sintered substrate, via holes of well-defined diameters are needed to produce conductive connections between different metallization layers, and to insert pins.

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Thermoplastic Powders as Filling Materials for Special Ceramic Substrates

A method is described to avoid the closing of via holes punched in green ceramic substrates during the subsequent lamination process. In the sintered substrate, via holes of well-defined diameters are needed to produce conductive connections between different metallization layers, and to insert pins.

After the via holes have been punched, they are filled by screen printing with a paste containing a thermoplastic powder. The powder consists for instance of polyethylene, polypropylene, polybutylene, and polyamide. The printed green sheets are laminated under heat and pressure, at which the mechanical and chemical properties of the thermoplastics prevent a change of the via hole shape. During the sintering of the laminates the thermoplastic material is cracked and volatilizes quantitatively, without any influence on the specific properties of the ceramic system.

The shrinkage of the holes during sintering is controllable, so that the multilayer ceramic substrate obtained has via holes of predetermined dimensions. The method works in a reproducible way.

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