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Flexible Circuit Package for Mechanical Thermal Pulse Bonding

IP.com Disclosure Number: IPCOM000079819D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

DeBoskey, WR: AUTHOR

Abstract

A flexible fan-out or circuit pattern is simultaneously gang bonded to integrated circuit chips and passive components by mechanical thermal pulse (MTP) bonding; and simultaneously back bonded to a thermal heat sink, if required. The flexibility and the thickness of the bonded lines provide the necessary bonding process compliancy. Automatable reel-type handling equipment may be used in conjunction with a high-speed MTP process to lower costs.

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Flexible Circuit Package for Mechanical Thermal Pulse Bonding

A flexible fan-out or circuit pattern is simultaneously gang bonded to integrated circuit chips and passive components by mechanical thermal pulse (MTP) bonding; and simultaneously back bonded to a thermal heat sink, if required. The flexibility and the thickness of the bonded lines provide the necessary bonding process compliancy. Automatable reel-type handling equipment may be used in conjunction with a high-speed MTP process to lower costs.

An integrated circuit chip 10 or discrete component is simultaneously bonded by a mechanical thermal pulse (MTP) process to the multiple leads of a flexible fan-out or circuit pattern 11 and a heat sink 12. The lines of the flexible pattern 11 are sized to properly handle electrical and/or thermal requirements. The flexible pattern may be produced by etching or stamping polymer backed or unbacked metal foil of 1-20 mils thickness having bonding qualities. A back bond 13 may include a ductile, nonwork hardening metal such as indium or lead. MTP bonding produces a solid-state diffusion bond to the chip 10. The heat sink 12 minimizes contamination of the indium and hence precludes alteration of the desirable mechanical properties of the metal. The package is completed by encapsulating the bonded flexible subassembly with a suitable polymer 14 via coating or molding.

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