Browse Prior Art Database

Accurate Chip Placement on a Substrate

IP.com Disclosure Number: IPCOM000079820D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

DeBoskey, WR: AUTHOR [+2]

Abstract

This method of direct placement of chips from a wafer, circumvents the normal scribe/break and separate wafer processing with attendant loss of positioning accuracy due to reorientating and repositioning.

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Accurate Chip Placement on a Substrate

This method of direct placement of chips from a wafer, circumvents the normal scribe/break and separate wafer processing with attendant loss of positioning accuracy due to reorientating and repositioning.

A wafer 10 is adhesively joined to a web 12. One edge of the web serves as reference to a datum plane (Du) 14. The wafer 10 is diced by complete through cutting prior to mounting on a programmable X-Y table 16 of a chip transfer apparatus. A vacuum needle pickup mechanism 18 working in conjunction with push needle 20, lifts the chip directly from the wafer array adhesively joined to the web 12. The needles 18, 20 are precisely located to the Du of the X-Y table 16 which provides accurate chip-by-chip presentation. The vacuum needle pickup mechanism 18 moves to a precise Du(1) or chip placement position, where the chip is positioned on a substrate or lead frame (both not shown) for subsequent solder, ultrasonic or thermal compression bonding. The bonding head 22 may be an integral part of this transfer apparatus.

As an alternative method, the adhesive material may be chemically removed from the wafer while the wafer is held in situ on a vacuum chuck. As another alternative, the adhesive material may be softened by heating in the locale of the chip, to permit transfer from the web to the substrate or lead frame (both not shown) in the manner described.

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