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Lead Forming Apparatus for Dual In Line Packages

IP.com Disclosure Number: IPCOM000079822D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Knight, LJ: AUTHOR

Abstract

Leads for dual-in-line packages may be formed to their final configuration without damage to the lead or gold plating by the action of a roller, which bends the lead without the need for any die with attendant lead breakage and plating degradation.

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Lead Forming Apparatus for Dual In Line Packages

Leads for dual-in-line packages may be formed to their final configuration without damage to the lead or gold plating by the action of a roller, which bends the lead without the need for any die with attendant lead breakage and plating degradation.

A dual-in-line package 10 with lead members 12 is inserted between the members 14 and 16 of a holding fixture. An inexpensive nylon is suitably shaped to form the fixture members, as shown in Fig. 1. Once the package is clamped in the apparatus, as shown in Fig. 2, a pair of rollers 18 or the holding fixtures are moved relative to one another, as shown in Fig. 3, to form the leads 12 against the sides of the fixture in a desired configuration. The members 14 and 16 are separated to permit removal of the package and return to the load position of Fig.
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