Browse Prior Art Database

Electroless Gold Plating of Thick Films

IP.com Disclosure Number: IPCOM000079891D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 22K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR

Abstract

The present technique provides a method of depositing thick gold lines over interconnection metallurgy located on ceramic substrates. Initially, the substrates modules are cleaned by conventional means at 10. Thereafter, an electroless nickel plating operation 12 is employed to plate the molybdenum interconnection patterns and via paths. Thereafter, at 14, a selective gold plating operation is performed in order to deposit engineering change paths, which are ultimately used in conjunction with ultrasonic wire bonding at 16.

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Electroless Gold Plating of Thick Films

The present technique provides a method of depositing thick gold lines over interconnection metallurgy located on ceramic substrates. Initially, the substrates modules are cleaned by conventional means at 10. Thereafter, an electroless nickel plating operation 12 is employed to plate the molybdenum interconnection patterns and via paths. Thereafter, at 14, a selective gold plating operation is performed in order to deposit engineering change paths, which are ultimately used in conjunction with ultrasonic wire bonding at 16.

More specifically, the underlying metal depositing step at 12 is performed in conjunction with a codeposition step using a high-particulate material such as aluminum particles or molybdenum particles, so as to provide a porous nickel deposition. This porous nickel base allows a high resolution thick gold overlying pad deposition to be performed at 14, by an electroless gold plating technique.

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