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Solvent and Process for Removing Cured Polyamide Imide Coatings

IP.com Disclosure Number: IPCOM000079893D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Agnihotri, RK: AUTHOR [+2]

Abstract

Aliphatic diamines such as ethylene diamine have been found to be suitable solvents for etching cured polyamide-imide coatings.

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Solvent and Process for Removing Cured Polyamide Imide Coatings

Aliphatic diamines such as ethylene diamine have been found to be suitable solvents for etching cured polyamide-imide coatings.

A substrate such as a semiconductor module, which has been coated with a polyamide-imide polymer, is covered with a layer of photoresist. The photoresist layer is patterned by conventional techniques, to expose the portion of the polyamide-imide coating which is to be removed. The substrate is then placed in a container of ethylene diamine which is heated to 210 degrees F with stirring for 10 minutes. The polyamide-imide coating in the area exposed to the solvent is completely removed without damage to the substrate.

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