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Removably Mounting Substrates for Subsequent Photoetching Operations

IP.com Disclosure Number: IPCOM000079912D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Graham, MA: AUTHOR [+3]

Abstract

Accurate alignment of substrates for photographic exposure and subsequent photoresist removal has been difficult and time-consuming. Conventionally the substrates having, for example, a metallized surface, have been fixed to a frame mounted piece of thermoplastic by heating the thermoplastic to an elevated temperature and then pressing the soft thermoplastic against the substrates, the substrates being positioned in a locator to assure proper spacing and circulation. Once the thermoplastic cools, the substrates are stuck to the thermoplastic and then the processing steps of exposing, developing, etc. are carried out on the substrates, while they are fixed to the plastic. Since the plastic is impervious, chemicals are entrapped and leave a chemical residue in any holes which happen to be in the substrate.

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Removably Mounting Substrates for Subsequent Photoetching Operations

Accurate alignment of substrates for photographic exposure and subsequent photoresist removal has been difficult and time-consuming. Conventionally the substrates having, for example, a metallized surface, have been fixed to a frame mounted piece of thermoplastic by heating the thermoplastic to an elevated temperature and then pressing the soft thermoplastic against the substrates, the substrates being positioned in a locator to assure proper spacing and circulation. Once the thermoplastic cools, the substrates are stuck to the thermoplastic and then the processing steps of exposing, developing, etc. are carried out on the substrates, while they are fixed to the plastic. Since the plastic is impervious, chemicals are entrapped and leave a chemical residue in any holes which happen to be in the substrate.

Referring to the drawing, means are provided for gripping the substrates to inhibit chemical residue in any apertures which may be in the substrate, while permitting photoresist application and exposure of the substrate in subsequent processing operations. The substrates 10 are mounted in apertures 11 in a locating template 12, the locating template having at least a pair of locating pins 13 and 14 which cooperate with apertures 15 and 16 in a mounting plate 17 (see Fig. 2).

The mounting plate 17 includes a plurality of spaced apart rows 18, 19, 20 and 21 of double-sided adhesive material, and a...