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Browse Prior Art Database

Dual In Line Package Socket Piggyback Structure

IP.com Disclosure Number: IPCOM000079914D
Original Publication Date: 1973-Sep-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

McAtee, DJ: AUTHOR

Abstract

When packaging dual-in-line package components, the situation often arises when the area available is insufficient for the number of components to be packaged. One solution to this problem is to package the components one above the other by using a "Piggyback Dip Socket".

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Dual In Line Package Socket Piggyback Structure

When packaging dual-in-line package components, the situation often arises when the area available is insufficient for the number of components to be packaged. One solution to this problem is to package the components one above the other by using a "Piggyback Dip Socket".

Component 1 plugs into piggyback socket 2 which plugs into a receptacle on the printed-circuit board 5. Beneath socket 2 is component 3 which may plug directly into the printed-circuit board 5 or into a standard commercial socket 4, as shown, which plugs into the board. Preferably a space is allowed intermediate the components and socket to facilitate the flow of air.

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