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Vacuum Operated Silk Screening Techniques

IP.com Disclosure Number: IPCOM000080005D
Original Publication Date: 1973-Oct-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Gonin, R: AUTHOR [+3]

Abstract

Silk screening techniques are widely used in the manufacture of ceramic multilayer circuits, particularly for defining the desired conductive interconnection pattern.

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Vacuum Operated Silk Screening Techniques

Silk screening techniques are widely used in the manufacture of ceramic multilayer circuits, particularly for defining the desired conductive interconnection pattern.

Standard silk screening techniques involve the use of molybdenum masks in conjunction with squeegees, which force the conductive paste to fill the mask holes according to the desired pattern. However, these techniques have several inherent limitations, particularly due to the fragility of the masks which are often destroyed under the pressure of the squeegees. Therefore, a new silk screening method is suggested which avoids the need of squeegees by combining the action of pressure and vacuum.

According to the drawing, the mask 10, the ceramic green sheet 11 provided with via holes 12, and a plastic sheet 13 are correctly aligned between two chambers 14, 15. The chambers are connected to a vacuum source 16 by suitable pipes. Chamber 14 is provided with a quantity of conductive paste 17. The process is as follows: 1) Vacuum is applied to both chambers 14 and 15. 2) The vacuum is released and a positive pressure is applied to the two chambers. The plastic sheet 13 then acts as a valve to close via holes 12 which are then filled with the paste 17. Simultaneously the desired pattern over the green sheet 11 is defined according to the mask's openings.

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