Browse Prior Art Database

Spin Coating Photoresist

IP.com Disclosure Number: IPCOM000080025D
Original Publication Date: 1973-Oct-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Reed, PW: AUTHOR [+2]

Abstract

This apparatus provides a technique for spin coating photoresist on a plurality of substrates, with no appreciable photoresist buildup at at least one edge of the substrate.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 77% of the total text.

Page 1 of 2

Spin Coating Photoresist

This apparatus provides a technique for spin coating photoresist on a plurality of substrates, with no appreciable photoresist buildup at at least one edge of the substrate.

Normally, when a small substrate is rotated concentrically around its own center of gravity during spin coating of photoresist, the photoresist spreads in a manner which causes a buildup of coating at each edge of the substrate. Edge buildup of photoresist is undesirable where the edge of the item being fabricated is to be at the edge of the substrate. Fabrication of a part at an edge built up with photoresist is difficult, due to image distortion or incomplete development at the edge caused by the thickened photoresist. In the absence of level photoresist at an edge where edge fabrication is desired, it is necessary to fabricate the part inboard from the edge, and then, for example, grind away a portion of the substrate following fabrication. This can be an expensive and time-consuming operation, especially when the substrate is a hard material such as glass, ferrite, silicon dioxide, quartz, or ceramic.

The present apparatus avoids photoresist buildup at one edge of the substrate. The method consists of spin coating photoresist on a plurality of substrates 2, distributed in a weight balanced pattern around the center of a spinning chuck 4. The individual substrates are each "off-center" or eccentric during spin coating. This procedure provides a photoresist coating...