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Accurate Preparation for Electron Microscopy

IP.com Disclosure Number: IPCOM000080056D
Original Publication Date: 1973-Oct-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bohg, A: AUTHOR [+2]

Abstract

For examining disk-shaped semiconductor materials by transmission electron microscopy, the thickness of the material has to be accurately reduced at the respective position. This is performed by ultrasonic drilling from the back down to a material thickness of 30 to 50 mu m, and by subsequent etching until, with a thickness of some thousand angstrom, the necessary transparency of the material is reached.

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Accurate Preparation for Electron Microscopy

For examining disk-shaped semiconductor materials by transmission electron microscopy, the thickness of the material has to be accurately reduced at the respective position. This is performed by ultrasonic drilling from the back down to a material thickness of 30 to 50 mu m, and by subsequent etching until, with a thickness of some thousand angstrom, the necessary transparency of the material is reached.

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