Browse Prior Art Database

Adjustable Fluid Profile Control for Etching

IP.com Disclosure Number: IPCOM000080077D
Original Publication Date: 1973-Oct-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Hecker, EP: AUTHOR

Abstract

In float processing it is difficult to obtain uniform etching of metals deposited on the silicon wafer. The problem has been one of nonuniformity or undesirable differences in the uniformity of the fluid profile being used to etch the metal. For example, it may be desirable to provide a greater height or pressure of fluid at the central portion than at the outer periphery of the wafer or vice versa.

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Adjustable Fluid Profile Control for Etching

In float processing it is difficult to obtain uniform etching of metals deposited on the silicon wafer. The problem has been one of nonuniformity or undesirable differences in the uniformity of the fluid profile being used to etch the metal. For example, it may be desirable to provide a greater height or pressure of fluid at the central portion than at the outer periphery of the wafer or vice versa.

Referring to the drawing, a float processor 10 is shown with a V-shaped trough 11 which is normally full of the etching liquid 12. A porous bed 13 is superimposed over the trough 11 and permits the liquid to flow therethrough, to form a fluid profile 14 upon which the semiconductor wafer is positioned.

In order to vary the fluid profile, the supply pipe 15 which enters through the bottom of the trough 11 is preferably permitted to vary with regard to its height relative to the porous bed 13. In this connection, an O-ring seal 16 circumscribes the pipe 15 so as to prevent fluid leakage from the trough, while permitting raising and lowering of the pipe 15 closer and farther away from the surface of the porous bed 13, to thereby effect the contour of the fluid profile.

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