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Magnetic Film Plating Cell

IP.com Disclosure Number: IPCOM000080107D
Original Publication Date: 1973-Oct-01
Included in the Prior Art Database: 2005-Feb-26
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Barclay, DJ: AUTHOR [+2]

Abstract

A magnetic film can be plated from electrolyte 1 onto a square substrate 2, mounted by screw 3 in a circular recess in substrate holder 4. A substantially cylindrical inner cell 5 surrounds the substrate 2 and projections from the lower edge of the inner cell locate in the gaps between the substrate and its surrounding recess.

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Magnetic Film Plating Cell

A magnetic film can be plated from electrolyte 1 onto a square substrate 2, mounted by screw 3 in a circular recess in substrate holder 4. A substantially cylindrical inner cell 5 surrounds the substrate 2 and projections from the lower edge of the inner cell locate in the gaps between the substrate and its surrounding recess.

The substrate holder 4 extends longitudinally within a channel shaped outer cell 6. Further recesses in holder 4 and corresponding inner cells 5, not shown, enable several substrates to be plated simultaneously. The individual inner cells restrict both convection currents and electric currents in the electrolyte, thereby giving more uniform deposition. A channel-shaped horseshoe section magnet 7 applies a magnetic field to the film during plating.

Each inner cell 5 contains an anode 8 and a spring loaded rod contact 9 for connecting the substrate 2 as a cathode. A capillary 10 is positioned near the substrate 2 and a syringe 11 draws off electrolyte from the cathode region to a reference electrode 12.

Plating is carried out in so-called "potentiostatic" fashion, in which the potential difference between the cathode and the reference electrode is maintained constant by feedback control of the anode - cathode voltage.

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