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High Power/High Density Modular System and Package

IP.com Disclosure Number: IPCOM000080165D
Original Publication Date: 1973-Nov-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Gillett, JB: AUTHOR

Abstract

Wedge-shaped packages may be combined into a modular system that (1) places cooling adjacent to the packages, and (2) provides central power distribution and wiring channels for interconnecting the packages. The package shape provides low-insertion force with good thermal and electrical contact. The packages may also be opened for easy repair and may be removed without disconnecting power to the system.

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High Power/High Density Modular System and Package

Wedge-shaped packages may be combined into a modular system that (1) places cooling adjacent to the packages, and (2) provides central power distribution and wiring channels for interconnecting the packages. The package shape provides low-insertion force with good thermal and electrical contact. The packages may also be opened for easy repair and may be removed without disconnecting power to the system.

A plurality of wedge-shaped packages 10 are stacked in columns between cooling elements 12, and engage a wiring channel 14 and power bus 16 to form a modular system 18. The cooling elements may be water or air cooled units. Fig. 1 shows how the packages 10 may be stacked to provide local regulation for a load 20. If access is required to the channel 14, the load 20 may be placed above the power supplies with the load power connection in the same plane as the wiring area 14.

One wedge-shaped package 10 is shown in Fig. 2. Components 30, 32 and the like, which dissipate considerable power, or are massive and require mechanical strength, are fixed to a heat sink 34.

In one form, the heat sink may be a cold plate that abuts the cooling elements 12 in Fig. 1. All components are interconnected by a copper-clad flexible film 36 containing slots and tongues to accommodate different component heights and to permit rework. The film 36 also connects to the I/O pins 38 of the package.

A plastic hinge 40 allows the package to...