Browse Prior Art Database

Component Container with Removable Lid

IP.com Disclosure Number: IPCOM000080167D
Original Publication Date: 1973-Nov-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

DalCero, N: AUTHOR

Abstract

This container permits rework of semiconductor or other devices directly attached to a substrate. The container may be resealed after rework.

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Component Container with Removable Lid

This container permits rework of semiconductor or other devices directly attached to a substrate. The container may be resealed after rework.

A printed-circuit board or ceramic substrate member 10 includes suitable conductors and other elements to connect with one or more semiconductor chips, not shown. A container 12, typically metal but also of other materials, surrounds and encloses the semiconductor chips and/or other components attached to the member 10. The container 12 is adhesively joined to the substrate. A lid 14 includes an adhesive backed metal member 16 and seals the container from the atmosphere. In one form, the metal may be aluminum and epoxy adhesive 18. Other combinations of materials may also be employed.

In each case, the epoxy adhesive peel strength must be less than the shear or tensile strength of the metal. When this is the case, a tab 20 incorporated into the member 16 may be twisted to roll the lid off the container. The removal of the lid from the container does not introduce any adverse effects to the connection between the container and the printed-circuit board or substrate.

The component within the container may be reworked and a new member 14 attached to the enclosure after the surface 22 is cleaned by a suitable solvent.

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