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Water Soluble Blister Packaging for Electrical Components

IP.com Disclosure Number: IPCOM000080173D
Original Publication Date: 1973-Nov-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Crosby, EG: AUTHOR [+3]

Abstract

Circuit modules and other small electrical components are conventionally attached to circuit boards, by soldering the component leads to conductive lands on the board. The components are first loosely assembled on the board with their leads extending through holes in the board, to the side containing the pattern of conductive lands. The board is soldered and is then rinsed in water to remove the soldering flux.

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Water Soluble Blister Packaging for Electrical Components

Circuit modules and other small electrical components are conventionally attached to circuit boards, by soldering the component leads to conductive lands on the board. The components are first loosely assembled on the board with their leads extending through holes in the board, to the side containing the pattern of conductive lands. The board is soldered and is then rinsed in water to remove the soldering flux.

In this method, the side of the circuit board that contains the loosely assembled components is covered with a plastic film of polyvinyl alcohol, so that the components are held in blisters in the film. The film holds the unsoldered components in place during the soldering operation and during handling of the board before the soldering operation. The film is water soluble and is readily removed from the card during the normal water rinse operation that follows soldering.

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