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Backside Resist Application

IP.com Disclosure Number: IPCOM000080298D
Original Publication Date: 1973-Nov-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Cook, F: AUTHOR [+2]

Abstract

In device application it is ofttimes necessary to apply resist to the backside of wafers, for example for diffusion operations. Normally, wafers 1 are placed facedown on a substantially planar surface 2 of a rotating spindle 3 provided with a vacuum port 4 to secure the wafer to the chuck. On application of a prescribed quantity of resist, the chuck is rotated for distribution of the resist across the backside of the wafer.

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Backside Resist Application

In device application it is ofttimes necessary to apply resist to the backside of wafers, for example for diffusion operations. Normally, wafers 1 are placed facedown on a substantially planar surface 2 of a rotating spindle 3 provided with a vacuum port 4 to secure the wafer to the chuck. On application of a prescribed quantity of resist, the chuck is rotated for distribution of the resist across the backside of the wafer.

Unfortunately, such mounting of the wafers results in the abrasion of the front face of the wafers increasing probabilities of defects in the throughput.

To reduce abrasion of the front face of wafers 1, the support surface 2 of the chuck is recessed at 5 to define an annular peripheral range 6 to minimize contact of the wafer on the chuck. A series of vacuum ports 7 are distributed about the annular ring 6 of the chuck, for purposes of securing wafer 1 during resist application and during the rotation of the chuck.

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