Browse Prior Art Database

Floatation Firing of Ceramic Substrates

IP.com Disclosure Number: IPCOM000080304D
Original Publication Date: 1973-Nov-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Gardner, RA: AUTHOR [+2]

Abstract

During the sintering or firing of ceramic green sheets, particularly laminated green sheets used to form multilayer ceramic packages, it is difficult to maintain package planarity due to distortions caused by high temperature sintering. In the present method, Fig.1, the multilayer ceramic substrate 10 is placed in a high temperature resistant holder 12 and is supported by a plurality of pins 14 prior to sintering. Also, the container 12 is filled with a high-melting, noble-metal alloy 16.

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Floatation Firing of Ceramic Substrates

During the sintering or firing of ceramic green sheets, particularly laminated green sheets used to form multilayer ceramic packages, it is difficult to maintain package planarity due to distortions caused by high temperature sintering. In the present method, Fig.1, the multilayer ceramic substrate 10 is placed in a high temperature resistant holder 12 and is supported by a plurality of pins 14 prior to sintering. Also, the container 12 is filled with a high-melting, noble-metal alloy
16.

The ceramic substrate 10 is supported on the plurality of pins 14 having a lower thermal coefficient of expansion than the noble metal 16. During sintering, Fig. 2, the noble metal 16 melts in the temperature range of 1300 to 1400 degrees C and expands to lift the ceramic substrate 10 off of the supporting pins 14 and completely supports the substrate. The molten metal eliminates all frictional drag normally experienced when using prior art supporting techniques. After sintering, Fig. 3, the temperature is reduced and the molten metal 16 solidifies and contracts, so as to lower the ceramic substrate 10 down to a pin supporting position.

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