Browse Prior Art Database

Contamination Free Wafer Processing

IP.com Disclosure Number: IPCOM000080330D
Original Publication Date: 1973-Dec-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Brenneman, BF: AUTHOR [+4]

Abstract

Wafers are protected against damage and/or contamination between hot processing and photolithographic processing.

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Contamination Free Wafer Processing

Wafers are protected against damage and/or contamination between hot processing and photolithographic processing.

The wafers 1 which are removed for example, from an oxidation furnace are cooled and placed in a wafer carrier 2. The carrier is placed in a plastic bag 3 and the bag is evacuated and sealed by seal 4, so that the bag collapses around the edges of the wafers and holds them firmly in place. The wafers are then transported to the photolithography resist apply station, where the bag is opened and the wafers removed just prior to resist application. This wafer packaging, after hot processing, permits resist processing without the need for water and acid precleaning steps, and/or the addition of resist adhesion promoters.

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