Browse Prior Art Database

Wafer/Chip Manufacture

IP.com Disclosure Number: IPCOM000080369D
Original Publication Date: 1973-Dec-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Galloway, A: AUTHOR [+7]

Abstract

The handling of semiconductor chip production through the wafer scribing and testing stages of manufacture is enhanced by this procedure.

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Wafer/Chip Manufacture

The handling of semiconductor chip production through the wafer scribing and testing stages of manufacture is enhanced by this procedure.

a) Coat the top surface of the wafer with a thin layer of nylon.

b) Scribe the wafer through the nylon top coating (e.g., by laser). The function of the nylon coating in this step is to prevent burring.

c) Remove the nylon from the scribed (but unfractured) wafer by dissolution of the nylon in a solution of isopropyl alcohol - trichboraethylene 50/50.

d) Coat the bottom surface of the wafer with a layer of nylon forming a supportive substrate for testing and fracturing.

e) Test the wafer and record locations of defective chips.

f) Fracture the wafer (which remains held as an aggregate by the nylon undercoat of step d).

g) Referring to the record of defective chip locations (step e) selectively remove the defective chips from the fractured aggregate, by localized application of nylon solvent to the sites of the defective chips. This causes localized dissolution of the nylon undercoat at the defective sites.

h) Remove (dissolve) nylon undercoat from remaining aggregate of undefective chips.

An alternative to the procedure of steps e)-h) above would be: e') Fracture the wafer at chip boundaries;, f') Test for defective chips;

g') Remove defective chips in the course of testing by localized application of nylon solvent and vacuum pickup to the test site (this eliminates the repositioning requirement of step g...