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Magnetic Bubble Domain Electronic Package

IP.com Disclosure Number: IPCOM000080375D
Original Publication Date: 1973-Dec-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 86K

Publishing Venue

IBM

Related People

Zipay, M: AUTHOR

Abstract

This magnetic bubble domain electronic package consists of a thin layer of ferromagnetic material, as the bubble source, deposited on a chip substrate 12. The ferromagnetic material bubble source is encompassed within three orthogonally oriented magnetic fields X, Y and Z, consisting of two perpendicular reversing fields X, Y to control bubble movement within the plane of the domain layer 10, and one stable bias field Z to establish and maintain bubble form. The package includes two wire-wound, solenoid-type (flat) coils 14,16 for the X and Y control fields, respectively. These wire-wound, solenoid-type coils 14,16 are wound on a ceramic substrate 18.

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Magnetic Bubble Domain Electronic Package

This magnetic bubble domain electronic package consists of a thin layer of ferromagnetic material, as the bubble source, deposited on a chip substrate 12. The ferromagnetic material bubble source is encompassed within three orthogonally oriented magnetic fields X, Y and Z, consisting of two perpendicular reversing fields X, Y to control bubble movement within the plane of the domain layer 10, and one stable bias field Z to establish and maintain bubble form. The package includes two wire-wound, solenoid-type (flat) coils 14,16 for the X and Y control fields, respectively. These wire-wound, solenoid-type coils 14,16 are wound on a ceramic substrate 18.

Holes 22 are provided at the corners of the substrate 18 for making input/output connections. The substrate 18 further includes personalization consisting of gold plated etched copper circuitry 24 and plated through-holes 22. The pins 26 are soldered into the substrate holes 22 during assembly. The bubble and sense amplified for recognizing the bubble condition are in the form of chips, which are located on the substrate 18.

A bobbin 28 is utilized to support the field generating coils. It is formed of insulative material with an area profile matching that of the substrate 18, and incorporating the necessary coil grooves 20. The Z coil or the bias coil 21 forming the bubble can be applied to the package in a variety of ways.

The bobbin 28 can have an appropriate cutout porti...