Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Spring Test Probe

IP.com Disclosure Number: IPCOM000080396D
Original Publication Date: 1973-Dec-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Barnum, PH: AUTHOR

Abstract

The test probe device 1 of Figs. 1-3 eliminates intermittent contact problems, bent pins, and damaged pin interconnection wires on boards being tested by earlier test probes. The device 1 is adapted for probing the wiring side of a printed-circuit board. The device probes one complete card socket (24 pins) at one time. The device consists of a mounting block 2, locating block 3, and standard spring probes 4, screws 5, and probing block 6. The "one wide spring test probe" is connected to a cable directly or through the use of a standard pin and connector arrangement. If the pin and connector arrangement is used, the locating block 3 and the mounting block 2 are combined into one block.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 78% of the total text.

Page 1 of 2

Spring Test Probe

The test probe device 1 of Figs. 1-3 eliminates intermittent contact problems, bent pins, and damaged pin interconnection wires on boards being tested by earlier test probes. The device 1 is adapted for probing the wiring side of a printed-circuit board. The device probes one complete card socket (24 pins) at one time. The device consists of a mounting block 2, locating block 3, and standard spring probes 4, screws 5, and probing block 6. The "one wide spring test probe" is connected to a cable directly or through the use of a standard pin and connector arrangement. If the pin and connector arrangement is used, the locating block 3 and the mounting block 2 are combined into one block.

One earlier probe was a standard paddle card. By probing on the wiring side of the board, the pin interconnection wires were being damaged by inserting the paddle card too far on the pins. This action would tend to loosen or remove the wires wrapped around the pins. If the paddle card was pushed on the pin so that it would not damage the wires, then intermittent contact would result. Also, if the paddle card were not positioned properly when it was inserted on the pins, bending of the pins could result.

The "one wide spring test probe" device 1 allows the wiring side of a standard board to be probed without bending pins or damaging the wraps of the wires. In addition it overcomes the intermittent contact problems of the original probe.

At each pin location in the l...