Browse Prior Art Database

Rotating Hot Plate

IP.com Disclosure Number: IPCOM000080523D
Original Publication Date: 1974-Jan-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 79K

Publishing Venue

IBM

Related People

Htoo, MS: AUTHOR [+3]

Abstract

Shown is an apparatus for heating and transporting processed semiconductor wafers through an inert atmosphere.

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Rotating Hot Plate

Shown is an apparatus for heating and transporting processed semiconductor wafers through an inert atmosphere.

The apparatus comprises a rotating hot plate 1 suitably driven by a conventional motor mechanism, not shown, upon an axis 2. The top surface is provided with an annular array of recessed seats 3, in which wafers are placed for rotation of the wafers 4 between any suitable load and unload position of the rotating hot plate.

Mounted about required portions of the rotating hot plate 1 is a hood 5 defining enclosure 6 for an inert gas, such as nitrogen, emitted from a series of distribution ports 7 of a header 8 secured in a suitable distribution pattern within shield 5 to the top wall thereof. As shown, one end of header 8 is closed shut with the other end to be connected to a source of nitrogen, not shown.

Each wafer position of the hot plate is provided with a pair of slide channels 10 for receiving a reciprocating cam slide 11, whose camming surfaces are defined by upwardly projecting arcuate portions 12. Each cam slide 11 is secured to a plunger 13 which is biased outwardly by a spring 14. Plunger 13 is provided with a shoulder 15 which abuts against an inwardly extending flange 16, to limit the outward travel of plunger 13 when it is not cammed inwardly by a camming unit 17.

Associated with each slide shaft 11 are a pair of lift pins 20 slidably mounted within apertures 21 which extend upwardly from slide shaft 11. In operation, lift...