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Browse Prior Art Database

Substrate Slicing Coolant Feed System

IP.com Disclosure Number: IPCOM000080582D
Original Publication Date: 1974-Jan-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Mendel, E: AUTHOR

Abstract

A device for slicing boules of optical or other electronic materials, such as silicon, bubble domain garnets, cadmium telluride, or lithium niobate is proposed which obtains wafers with minimum slicing damage. This structure provides a dynamically stable I.D. or O.D. cutting wheel, and thereby reduces damage on the surface of the wafers and reduces the kerf. Consequently, less subsequent polishing of the wafer surfaces is required.

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Substrate Slicing Coolant Feed System

A device for slicing boules of optical or other electronic materials, such as silicon, bubble domain garnets, cadmium telluride, or lithium niobate is proposed which obtains wafers with minimum slicing damage. This structure provides a dynamically stable I.D. or O.D. cutting wheel, and thereby reduces damage on the surface of the wafers and reduces the kerf. Consequently, less subsequent polishing of the wafer surfaces is required.

The device uses uniform and controlled applications of a coolant on a blade during the slicing operation. Figs. 1 and 2 show the head structure used to apply coolant to the blade. In these views, the head 10 has an input port 12 for receiving the coolant and a plurality of channels 14A, 14B and 14C, which lead to orifices A, B and C. In Fig. 3, the head 10 is located in proximity to the cutting blade 16.

In operation, the coolant flow is split into three parts near the slicing blade edge. One stream is fed to the edge of blade 16, while the coolant streams from channels 14A and 14C are fed to the sides of blade 16. Orifice openings A and C must be equivalent in order to make the streams coming from orifices A and C equal. However, these streams may be different from a stream coming from orifice B.

Balancing the coolant streams in this manner provides dynamic stabilization of the rapidly rotating cutting blade 16. This in turn leads to reduced surface damage and minimum kerf. Additionally, the life...