Browse Prior Art Database

Continuous Wet Chemical Process for Low Cost Fabrication of Bubble Devices

IP.com Disclosure Number: IPCOM000080584D
Original Publication Date: 1974-Jan-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Powers, JV: AUTHOR [+2]

Abstract

Current methods employed for the fabrication of magnetic bubble devices are costly and sophisticated. These high-processing costs demand high-bit densities in order to keep costs per bit low. What is proposed is a process for reducing processing costs by utilization of a continuously wet chemical process.

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Continuous Wet Chemical Process for Low Cost Fabrication of Bubble Devices

Current methods employed for the fabrication of magnetic bubble devices are costly and sophisticated. These high-processing costs demand high-bit densities in order to keep costs per bit low. What is proposed is a process for reducing processing costs by utilization of a continuously wet chemical process.

The illustrated process utilizes a flexible media such as polyimide or polyester tape, as a substrate material. This tape is sensitized by depositing chemically a thin layer of a catalytic metal such as Pd. This layer of a catalytic metal is then used to initiate the electroless deposition of an amorphous bubble domain material, such as AuCo or PtCo. This layer could also be deposited electrolytically if a cathode layer were first deposited.

The bubble material is then covered with an insulating material of desired thickness. A propagation patter of a high-permeability material is deposited on the insulator, either by masking techniques or by selective sensitization. The sensitization and masking techniques are then repeated to delineate the conductor pattern. If necessary, the conductor thickness can be built up electrolytically.

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