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Electrophoretic Deposition Using an Immiscible Solution

IP.com Disclosure Number: IPCOM000080591D
Original Publication Date: 1974-Jan-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Ciancanelli, JM: AUTHOR

Abstract

Selective coating of the land and chip surface of a substrate by electrophoretic deposition (EPD) can be accomplished utilizing an immiscible solution.

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Electrophoretic Deposition Using an Immiscible Solution

Selective coating of the land and chip surface of a substrate by electrophoretic deposition (EPD) can be accomplished utilizing an immiscible solution.

The substrates are placed upright on a nonconductive tray through which their pins protrude. The tray is placed in a tank which contains mercury, upon which floats a small amount of an immiscible solution and the EPD solution. The immiscible solution is heavier than the EPD solution and separates it from the mercury.

The substrate pins protrude through the immiscible solution to make electrical contact with the mercury. The tops of the substrates extend above the immiscible solution into the EPD solution. When the power is turned on, the portions of the substrates that surface into the EPD solution will be coated.

An alternative procedure is to eliminate the mercury and use only the immiscible solution and the EPD solution in the tank. In this case, a conductive medium would be placed in electrical contact with the substrate pins and would be connected to the power source.

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