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Etchable Silane Modified Polyimide Copolymer Conformed Coating

IP.com Disclosure Number: IPCOM000080650D
Original Publication Date: 1974-Jan-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Clark, RJ: AUTHOR [+3]

Abstract

The addition of 0.1% to 0.2% by weight solution of silane with a polyamic acid (product of a reaction of pyromellitric dianhydride and p, p-oxydiphenylene-diamine in a suitable polar solvent) forms a silane modified polyamic acid prepolymer system, which is capable of being partially cured, etched and post cured to form a copolymer.

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Etchable Silane Modified Polyimide Copolymer Conformed Coating

The addition of 0.1% to 0.2% by weight solution of silane with a polyamic acid (product of a reaction of pyromellitric dianhydride and p, p-oxydiphenylene- diamine in a suitable polar solvent) forms a silane modified polyamic acid prepolymer system, which is capable of being partially cured, etched and post cured to form a copolymer.

The modified polyimide copolymer possesses high-temperature stability characteristics of polyimide polymers as well as superior adhesion, allowing it to be used as a solder dam and conformal coating material in semiconductor device manufacture.

In application as a coating, the silane additive is mixed with diluted polyimide prepolymer and uniformly sprayed on the surface to be conformal coated. The liquid coating is then partially thermal cured to a polyamic acid/polyamide prepolymer film. Using well-known photo-lithography techniques a suitable photoresist is applied, and upon subsequent processing a photoresist protective pattern is obtained in areas where etch is not desired.

Etching of polyamic acid/polyamide prepolymer is accomplished using a strong basic solution (Ph 8-14). Photoresist is stripped and conformal coating is post cured to form the copolymer.

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