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Silicon Wafer Blow Dry Air Knife

IP.com Disclosure Number: IPCOM000080661D
Original Publication Date: 1974-Jan-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 65K

Publishing Venue

IBM

Related People

Fox, DD: AUTHOR [+2]

Abstract

This is a wafer drier for drying silicon wafers. The drier comprises a housing (removed for purposes of the drawing) in which a pair of plenum chambers 10 and 11 are disposed on opposite sides of a chamber 13. The plenum chambers are mounted on rod 14 of a hydraulic or air cylinder 15.

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Silicon Wafer Blow Dry Air Knife

This is a wafer drier for drying silicon wafers. The drier comprises a housing (removed for purposes of the drawing) in which a pair of plenum chambers 10 and 11 are disposed on opposite sides of a chamber 13. The plenum chambers are mounted on rod 14 of a hydraulic or air cylinder 15.

The wafer 16 is disposed intermediate the plenum chambers 10 and 11 by any convenient means. The plenum chambers each have respective narrow slits 10A and 11A facing towards each other, and thus towards the wafer 16. Nitrogen is applied to the plenum chambers 10, 11 through the hose. Upon energizing the hydraulic cylinder 15, the nitrogen passing through the slits effects peeling action of any liquid on the wafer. A vacuum may be drawn through the suction line 18 so as to remove moisture from the chamber 13.

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