Browse Prior Art Database

Multilayer Substrate Repair Method

IP.com Disclosure Number: IPCOM000080718D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Noth, RW: AUTHOR [+3]

Abstract

It may be necessary to repair, replace or remove defective segment(s) of multilayer solder pin interconnected substrates having semiconductor elements mounted thereon. This can be accomplished by providing a pass-through furnace having a heating zone operated at a temperature sufficient to melt or soften solder interconnection joints, and simultaneously actuate a mechanical means which is capable of exerting an appropriate force to separate a multilayer structure at a desired particular location.

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Multilayer Substrate Repair Method

It may be necessary to repair, replace or remove defective segment(s) of multilayer solder pin interconnected substrates having semiconductor elements mounted thereon. This can be accomplished by providing a pass-through furnace having a heating zone operated at a temperature sufficient to melt or soften solder interconnection joints, and simultaneously actuate a mechanical means which is capable of exerting an appropriate force to separate a multilayer structure at a desired particular location.

Fig. 1 illustrates a separation tool having a ratchet type locking means 1 and a bimetallic strip 2, comprising two metal layers having different coefficients of expansion which is secured on a base 3 at 4. This device is capable of being inserted between substrate layers of a multilayer structure. Insertion is accomplished by placing the tool(s) along the periphery of a particular separation point, outside of the interconnection joints.

The multilayer structure having the bimetallic device inserted is passed through a suitable furnace and as the temperature increases interconnection joints become molten and the bimetallic contracts exerting an upward force which causes layer separation. The ratchet 1 prevents return of the bimetallic strip 2 to the relaxed configuration upon cooling.

Fig. 2 illustrates the bimetallic strip 2 expanded in the strain position after heating and being so maintained by the ratchet holding mechanism 1.

Fig. 3...