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Semiconductor Air Track Handling Apparatus

IP.com Disclosure Number: IPCOM000080725D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Gagne, M: AUTHOR [+2]

Abstract

Semiconductor wafers or other light objects transported to and from sequential processing stations require orientation or positioning for mechanical or other pickup, preparatory to subsequent processing steps.

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Semiconductor Air Track Handling Apparatus

Semiconductor wafers or other light objects transported to and from sequential processing stations require orientation or positioning for mechanical or other pickup, preparatory to subsequent processing steps.

This is accomplished in an air track transport by a mechanism illustrated in the figure. A typical silicon semiconductor wafer 1 is carried in an air track 2 to a position at 3 where it is detected by any suitable sensing means. When in this position air flow is terminated and vacuum applied from beneath the bottom surface of the air track through vacuum chuck 5, while fingers 4 capable of moving in the directions X-Y-Z are simultaneously mechanically positioned about the wafer, as shown.

The chuck 5 is rotable and positions the wafer 1 so that the conventional notch and flat edge are in the desired finger enclosure configuration, as shown, and sensed by conventional photoelectric detection means 6, thereby establishing wafer 1 in the desired position, whereupon the fingers 4 are withdrawn back and extracted below the air track surface. The wafer is then ready for pickup.

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