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Adhesion of Polyimide to Integrated Circuit Substrates

IP.com Disclosure Number: IPCOM000080733D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Clark, RJ: AUTHOR [+2]

Abstract

Described is a process for improving the adhesion of polyimides to alumina surfaces. A polyimide resin is diluted with N-bethyl-2-pyrrolidinone in equal proportion by volume, as described below.

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Adhesion of Polyimide to Integrated Circuit Substrates

Described is a process for improving the adhesion of polyimides to alumina surfaces. A polyimide resin is diluted with N-bethyl-2-pyrrolidinone in equal proportion by volume, as described below.

Initially, half of the solvent volume is directly added into the polyimide resin, forming a two layered liquid system which is left undisturbed. To the remaining half of this solution a silane additive is added, such that 0.15 gram of the silane additive is provided for each 100 milliliters of the initial polyimide solution. This mixture is then poured into the N-methyl-2-pyrrolidinone layer of the resin mixture and the contents thoroughly mixed together to form a uniform solution.

This solution may be spun or ssprayed onto the surface which is to be joined. Once the solution has been deposited on the surface the coated surface is baked for 15 minutes at 90 degrees C, following which an intermediate bake of 20 minutes at 200 degrees C and a final bake of 20 minutes at 300 degrees C is provided. Thus, there is described a process which utilizes silane to modify a polyimide, to increase the molecular weight of the polyimide, and to improve the adhesion of the polyimide to the alumina surfaces.

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