Browse Prior Art Database

Wafer Drive Assembly

IP.com Disclosure Number: IPCOM000080761D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 3 page(s) / 104K

Publishing Venue

IBM

Related People

Scacciaferro, F: AUTHOR [+2]

Abstract

After a semiconductor wafer has been separated into discrete integrated circuit chips, the bond holding the wafer to the substrate must be removed and, thereafter, the chips separated in a manner to retain their orientation (for use of later handling) and for testing purposes. Conventionally, the separation process occurs in such a manner as to allow easy transfer of the chips to a palette having a plurality of apertures in the lower portion thereof, permitting suction pickup onto the palette of the semiconductor chips. A cover is then placed over the chips and the palette may be transported thereafter to other locations for appropriate handling. Obviously, when removing the cover from the palette it is necessary to draw a vacuum or otherwise hold or retain the chips to the palette.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 52% of the total text.

Page 1 of 3

Wafer Drive Assembly

After a semiconductor wafer has been separated into discrete integrated circuit chips, the bond holding the wafer to the substrate must be removed and, thereafter, the chips separated in a manner to retain their orientation (for use of later handling) and for testing purposes. Conventionally, the separation process occurs in such a manner as to allow easy transfer of the chips to a palette having a plurality of apertures in the lower portion thereof, permitting suction pickup onto the palette of the semiconductor chips. A cover is then placed over the chips and the palette may be transported thereafter to other locations for appropriate handling. Obviously, when removing the cover from the palette it is necessary to draw a vacuum or otherwise hold or retain the chips to the palette.

Referring to Fig. 1, a palette or diced wafer drive assembly is shown for moving a plurality of semiconductor chips on palettes 8 to a remote station for removing chips and mounting either on a substrate or other storage devices. Generally, the assembly includes a base and a movable table 9, which is mounted on guideways for moving the table from a loading position (lefthand end) to the chip unloading end (righthand end). A protective transparent cover is placed over the loading table 9 after the palettes 8 are positioned on the table and appropriately clamped.

Indexing of the table 9 does not occur, until a separation plate and cover photosensing cell indicates that a palette 8 is in the appropriate position. The semiconductor chips or wafers, or the palette itself, may be marked to identify the type of semiconductor chips on the particular palette 8 for ease of automatic control and proper location, upon removal of the chips, to the substrate to which the chips are mounted, or into a storage tray location for proper chip identification and storage.

Centrally located in the assembly is telescopic vacuum porting 7, which communicates with the table 9 and a manifold therein. Each of the palettes 8 with their covers (not shown) on are positioned over a clamp valve mechanism 10 (Fig. 2), the clamp-shutter valve mechanism then being actuated to draw a vacuum through the apertures in the palette, thereby clamping the individual semiconductor chips on to the palette. Thereaft...