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Improving the Deposition Rate of Electroless Gold Plating Solutions

IP.com Disclosure Number: IPCOM000080764D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR

Abstract

A member of the oxine family; such as dimethylglyoxime, diphenyl glycoxime, 1, 2 - cyclo hexanedione dioxime, 2, 4 - pentanedione dioxime, 0 - benzoquinone dioxime, furil dioxime; is added to an electroless or immersion gold plating bath. The oxime type additive forms organometallic compounds with impurity metals existing in the bath. This stabilizes the plating bath and accordingly increases the bath lifetime.

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Improving the Deposition Rate of Electroless Gold Plating Solutions

A member of the oxine family; such as dimethylglyoxime, diphenyl glycoxime, 1, 2 - cyclo hexanedione dioxime, 2, 4 - pentanedione dioxime, 0 - benzoquinone dioxime, furil dioxime; is added to an electroless or immersion gold plating bath. The oxime type additive forms organometallic compounds with impurity metals existing in the bath. This stabilizes the plating bath and accordingly increases the bath lifetime.

It appears that characteristic of both the immersion and electroless gold plating processes, is the fact that an ion replacement action occurs so as to create these ion-metal impurities. It is the chemical combination of the ion-metal impurities with the oximes that creates the organometallic compounds for bath stabilization purposes.

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