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Multilayer Ceramic by Slurry Casting Over Metallization

IP.com Disclosure Number: IPCOM000080766D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Fugardi, JF: AUTHOR [+2]

Abstract

Vias may be formed by an additive process, rather than subtractively removing material by a punching operation. By using the same particle size and metal as the conductor lines, and by using a similar printing technique such as multiple pass screening vias can be formed with the required height so that layer-to-layer connections can be made. A specialized printing process using a transfer molding concept would form a via in one operation. To expose the via after the slurry casting step, a skiving operation is employed as the texture of the unfired metallizing enables a clean cut to be made. The fabrication process steps for this technique are as follows: 1. Printing the conductive pattern 10 on a carrier sheet 11, (Fig.1). 2. Forming conductive vias 12 of the proper height at all the required locations, (Fig. 2). 3.

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Multilayer Ceramic by Slurry Casting Over Metallization

Vias may be formed by an additive process, rather than subtractively removing material by a punching operation. By using the same particle size and metal as the conductor lines, and by using a similar printing technique such as multiple pass screening vias can be formed with the required height so that layer-to-layer connections can be made. A specialized printing process using a transfer molding concept would form a via in one operation. To expose the via after the slurry casting step, a skiving operation is employed as the texture of the unfired metallizing enables a clean cut to be made.

The fabrication process steps for this technique are as follows:
1. Printing the conductive pattern 10 on a carrier sheet 11,

(Fig.1).
2. Forming conductive vias 12 of the proper height at all the

required locations, (Fig. 2).
3. Casting the ceramic slip 13 over the metallized carrier 11,

(Fig.3).
4. Skiving of the vias 12 and slip 13 to expose the conductors,

(Fig.4).
5. Removing the slip 13 with the metallizing from the carrier

strip 11, (Fig. 5).
6. Completion of the module by the usual multilayer ceramic

steps:

a) Punching registration holes,

b) Laminating and cutting to size, and

c) Sintering to final density.

Fig. 6 illustrates an example of a completed multilayer ceramic structure.

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