Browse Prior Art Database

High Density Interconnectable Package

IP.com Disclosure Number: IPCOM000080771D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Nufer, RW: AUTHOR

Abstract

Dual-inline packages (DIP) are produced by mounting a device backside down on a stamped lead frame, and then interconnecting the device to the remaining leads with wire bonds. The interconnected device is then encapsulated with a polymer providing a finished module. The delicate lead and interconnection are often stressed unduly by the encapsulant which is injected around the lead frame and device, resulting in instantaneous or ultimate failure.

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High Density Interconnectable Package

Dual-inline packages (DIP) are produced by mounting a device backside down on a stamped lead frame, and then interconnecting the device to the remaining leads with wire bonds. The interconnected device is then encapsulated with a polymer providing a finished module. The delicate lead and interconnection are often stressed unduly by the encapsulant which is injected around the lead frame and device, resulting in instantaneous or ultimate failure.

The package shown employs a lead frame which is bonded using a high- strength polymer adhesive interface to a low-expansion heat sink. This provides the lead frame with a structural base and a means of dissipating thermal energy. The low-expansion heat sink also compensates for thermal mismatches that exist between the polymer and the device.

The actual semiconductor device is isolated from the polymeric encapsulant by an elastomeric buffer coating, which protects the device during molding and after molding.

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