Browse Prior Art Database

Wafer Carrier

IP.com Disclosure Number: IPCOM000080779D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 3 page(s) / 53K

Publishing Venue

IBM

Related People

Mack, A: AUTHOR

Abstract

This is a wafer carrier for accurately locating and holding a wafer in position at a work station in a vacuum or controlled atmosphere. The semiconductor wafer is placed into the carrier, external to the controlled atmosphere, and radially oriented by a device other than the carrier. The wafer is then positioned and clamped in place in the carrier.

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Wafer Carrier

This is a wafer carrier for accurately locating and holding a wafer in position at a work station in a vacuum or controlled atmosphere. The semiconductor wafer is placed into the carrier, external to the controlled atmosphere, and radially oriented by a device other than the carrier. The wafer is then positioned and clamped in place in the carrier.

The wafer 10 is located in the carrier by a fixed locating pin 12 (roller) mounted in the carrier body and two movable locating pins 14 (rollers), mounted on a plate 16 affixed to a dovetail slide 18. The fixed pin 12 engages a notch in the periphery of the wafer 10 for radial location. The two movable pins 14 contact the periphery of the wafer opposite the notch pin 12, nesting the wafer 10 between the three pins 12 and 14 with controlled spring pressure applied by spring 20. The position of the nesting pins 12 and 14 are maintained in relation to a vee notch 22 and a flat 24 on the body of the carrier. The vee notch 22 and flat 24 enable the carrier to be located at a work station against two registration pins 26 and 28, controlling the location of the wafer 10 at the work station.

The carrier restson three pads 30 on it's bottom face. The wafer 10 rests on points 32 of a segmented ring on top of the carrier. It is clamped against these segmented surfaces by four controlled force spring clamps 34.

All wafer clamping and positioning functions are achieved by a twenty degrees rotational displacement of the cam ring 36. This allows single-point actuation to facilitate automatic wafer load/unload. The first ten degrees of radial displacement of the cam ring 36 allows the dovetail slide assembly (14, 16, 18) containing the movable wafer positioning pins 14, to nest the wafer 10 against the stationary notch locating pin 12. It also moves the spring wafer clamps 34 over the wafer 10. The remaining ten degrees of rotation of the cam ring 36 releases the spring clamps 34, allowing them to clamp the wafer 10 against the segmented ring rest surface of the carrier. By reversing the procedure...