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DC Sputtering Amorphous Films onto Flexible Substrates

IP.com Disclosure Number: IPCOM000080858D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Gambino, RJ: AUTHOR [+2]

Abstract

In many device applications, it is necessary to provide amorphous films on flexible substrates such as, for example, MYLAR*, KAPTON* or other continuous tapes or ribbons. In the providing of such films, it has been found difficult to effect heat sinking during sputtering. In this connection, if the substrate is not properly heat sunk, the amorphous film deposit will crystallize during deposition, and in the case of a heat-sensitive substrate material such as MYLAR, the substrate may even deform or otherwise degrade.

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DC Sputtering Amorphous Films onto Flexible Substrates

In many device applications, it is necessary to provide amorphous films on flexible substrates such as, for example, MYLAR*, KAPTON* or other continuous tapes or ribbons. In the providing of such films, it has been found difficult to effect heat sinking during sputtering. In this connection, if the substrate is not properly heat sunk, the amorphous film deposit will crystallize during deposition, and in the case of a heat-sensitive substrate material such as MYLAR, the substrate may even deform or otherwise degrade.

There is described herein a heat sinking device which overcomes these problems, This device is shown in end elevation in Fig. 1 and in plan view in Fig.
2. The device comprises a copper block 10 having a convex cylindrical section upper surface 12 and a flat bottom surface 14. The device also includes end clamping mechanisms 16 and 18. The flat bottom surface 14 suitably rests on a water cooled copper anode surface, such anode having a circular area which is large enough to accommodate the heat sink (the anode is not shown). It is not necessary to have an interfacing layer such as gallium or vacuum grease. The flexible substrate 20 is stretched over the convex surface 12 and held in place by the tightening end clamps 16 and 18.

The major advantage which accrues from the use of this heat sink is that the flexible substrate need not be coated with an interfaced layer like gallium, which is difficult...