Browse Prior Art Database

Solder Transfer Tinning

IP.com Disclosure Number: IPCOM000080869D
Original Publication Date: 1974-Feb-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Harden, EW: AUTHOR [+3]

Abstract

A method has been devised for tinning very closely spaced conductors that interconnect a circuit chip to lead lines, without electrically short circuiting the spaced conductors.

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Solder Transfer Tinning

A method has been devised for tinning very closely spaced conductors that interconnect a circuit chip to lead lines, without electrically short circuiting the spaced conductors.

The procedure involves a solder transfer technique. A copper plate 2, having a flat smooth top surface, is heated to 180 degrees C by a hot plate or other heating unit 4. The flat smooth top surface is tinned with a suitable solder 6 that melts at 150 degrees C, the solder being wiped to provide a very thin remanent layer of solder.

A chip 8 is then located onto the plate 2 so that its spaced conductors 10 are in contact with the melted solder. While the chip 8 is against the plate 2 and in contact with the melt, pressure is applied to the chip 8 towards the copper plate, transferring a very thin layer of solder from the copper plate 2 to the leads 10.

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