Browse Prior Art Database

Bubble Memory Chip Mounting

IP.com Disclosure Number: IPCOM000080895D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Brumley, RL: AUTHOR

Abstract

This method of mounting a bubble memory chip in a metallized ceramic substrate provides ease of chip orientation and relatively low noise, due to minimum Z axis displacement of the bubble sense output wires while inside the X and Y drive coil field.

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Bubble Memory Chip Mounting

This method of mounting a bubble memory chip in a metallized ceramic substrate provides ease of chip orientation and relatively low noise, due to minimum Z axis displacement of the bubble sense output wires while inside the X and Y drive coil field.

Figs. 1 and 2 show plan and elevation views, respectively, of bubble memory package 10. A hole is laser-cut in a metallized ceramic carrier 2 to accommodate the outside dimensions of bubble memory chip 1. Chip 1 and carrier 2 are inverted on a flat surface so that the top surfaces of chip 1 and carrier 2 lie in the same plane. Epoxy 6 provides support for chip 1 and fixes the location of chip 1 in the X, Y, and Z axes.

Bubble sense output wires 7 connecting chip 1 to sense amplifier 5 have essentially no Z axis displacement, because wires 7 lie substantially in the same plane as the top surface of chip 1. X and Y drive coils 3 and 4, therefore, are of a minimum diameter, Z1.

Because the top surfaces of chip 1 and carrier 2 lie in the same plane, absolute parallelism of coils 3 and 4 with respect to chip can be insured. The ease of orientation of chip 1 in the X and Y axes is aided by cutting the hole in carrier 2 only slightly larger than chip 1.

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